Faculty Publications

Design and Integration of a Multisensory Board for Real-Time Monitoring of Metal Casting Foundry Sand Molds

Document Type

Conference

Keywords

BME680, ESP8266, IoT, Metal Casting, MQTT, Node-RED, Real-Time Monitoring, SGP40

Journal/Book/Conference Title

2025 IEEE International Conference on Electro Information Technology

First Page

361

Last Page

366

Abstract

This paper presents the design and integration of a compact multisensory PCB node designed and aimed at enhancing real-time monitoring of the sand mold curing process in metal casting foundries. The board incorporates the ESP8266 microcontroller, BME680 sensor for temperature, pressure, and humidity readings, and the SGP40 sensor for volatile organic compounds (VOC) level detection independent of humidity. These parameters significantly affect the sand's properties including its moisture content and binder curing process, their tracking thereof would potentially help identify conditions that could lead to dents or breakages in the sand molds and hence proper control of the conditions could ensure that the sand maintains its integrity during the casting process, minimizing defects in the mold. These sensor data create the avenue for proactive adjustments, ultimately improving the quality and reliability of molds during production. The system ultimately aims to mitigate mold dents and breakages by enabling precise environmental monitoring.

Department

Department of Applied Engineering and Technical Management

Original Publication Date

8-12-2025

DOI of published version

10.1109/eIT64391.2025.11103671

Link to Full Text

Comments?

Share

COinS