Binding Mechanism of Ni and Cu on Layered Semiconductors

Author

• Caden Sadler, University of Nothern IowaFollow
• Ty Porter, University of Northern IowaFollow

Presentation Type

Oral Presentation

Start Date

13-4-2026 2:00 PM

End Date

13-4-2026 2:15 PM

Faculty Advisor

Pavel Lukashev

Department

Department of Physics

Student Type

Undergraduate Student

Comments

Award: National Science Foundation (NSF) Grant

Copyright

©2026 Caden Sadler and Ty Porter

Recommended Citation

Sadler, Caden and Porter, Ty, "Binding Mechanism of Ni and Cu on Layered Semiconductors" (2026). INSPIRE Student Research and Engagement Conference. 27.
https://scholarworks.uni.edu/csbsresearchconf/2026/all/27