Dispensing systems for fine-pitch assembly
Successful solder paste dispensing is dependent upon the control of three basic factors: the solder; the needle; and the dispensing tool. After cleaning residual solder from pads, dispensing new solder paste is important in final surface-mount reflow. Depositing the right amount of solder paste onto the pads of a printed circuit board (PCB) is a prerequisite for forming good solder joints. The three basic factors are discussed for successful PCB solder paste dispensing.
Original Publication Date
Fidan, Ismail, "Dispensing systems for fine-pitch assembly" (1999). Faculty Publications. 3826.