Faculty Publications

Dispensing Systems For Fine-Pitch Assembly

Document Type

Article

Journal/Book/Conference Title

Circuits Assembly

Volume

10

Issue

8

First Page

66

Last Page

69

Abstract

Successful solder paste dispensing is dependent upon the control of three basic factors: the solder; the needle; and the dispensing tool. After cleaning residual solder from pads, dispensing new solder paste is important in final surface-mount reflow. Depositing the right amount of solder paste onto the pads of a printed circuit board (PCB) is a prerequisite for forming good solder joints. The three basic factors are discussed for successful PCB solder paste dispensing.

Department

Department of Industrial Technology

Original Publication Date

1-1-1999

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